Benefits

  • Low inductance
  • Controlled partial discharge
  • High current and voltage capabilities
  • Compact and flexible
  • Fully customized
  • Possibility of component integration ( e.g. Capacitors )
  • Wide range of products tailored to specific power density and inductance

Products

ROLINX® CapLink Solutions

  • Unique soldering process mounts capacitors to ROLINX laminated busbars
  • Produces small, lightweight assemblies with extremely low inductance and high power density
  • Supports SiC technology

ROLINX® Compact

  • Most optimal connection solution for high power distribution in very limited space
  • Uses powder coating as outer insulation instead of insulation films, allowing for even greater compactness than a laminated busbar
  • Easy and quick to install
  • High power density capabilities and high temperature resistance

ROLINX® Easy

  • Most cost-efficient, simplified busbar solution
  • Designed to replace stacked busbars and simplify the supply chain

ROLINX® Flex

  • Flexible busbar with pure copper laminates
  • Offers flexibility for customized solutions
  • Space saving, easy and quick bending
  • Available in standard and customized length

ROLINX® Housing Solutions

  • Combines injection molding solutions with ROLINX busbar
  • Offers great flexibility for customized solutions
  • Features integration of connectors or structural functions

ROLINX® Hybrid

  • Combination of power and signal (logic) electronics on a single circuit
  • One-piece busbar solution reduces installation time and eliminates wiring errors
  • Simplifies the supply chain with a single-piece solution
  • Features integrated connectors and surface mount components

ROLINX® Performance

  • State-of-the-art laminated busbar technology for demanding, high power applications
  • Provides optimized inductance and controls partial discharge
  • Shaped to fit high voltage applications
  • Compact design

ROLINX® PowerCircuit Solution

  • Combines the advantages of PCB and laminated busbar
  • Meets the needs of low power applications with currents greater than 100 Amps
  • Fit for high volume assembly processes and interconnection techniques
  • Compact 3D design & wave soldering capability

ROLINX® Thermal

  • Enables existing power system design to be upgraded to a higher power level
  • Extended temperature 130 deg. C range and humidity rating
  • Allows for more power through the same copper section

Downloads

Description Language File Type File Size
Brochures
ROLINX Busbars General Overview English
310KB
ROLINX叠层母线排解决方案概览 中文
744KB
ROLINX e-Mobility Solutions Brochure English
1MB
ROLINX产品汽车应用手册 中文
7MB

Tools

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  • Design Support Hub

    Explore technical papers, data sheets, videos and more for busbars, ceramic substrates and cooling solutions.

Support

Advanced Electronics Solutions

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Olivier's Twist Blog

This monthly blog is contributed to by Olivier Mathieu and other experts from Rogers' Power Electronics Solutions, providing technical advice and information about advanced materials technologies that increase efficiency, manage heat and ensure quality and reliability.

Read the Olivier's Twist Blog

Capabilities

Experience the Rogers’ difference. Explore the capabilities our AES team offers.

Technology

Our patented technologies enable innovative designs to support high power applications.