TMM® 10i Laminates

TMM 10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM® series materials, TMM 10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

Features

• Dk of 9.80 +/- .245
• Dissipation factor of .0020 at 10GHz
• Thermal coefficient of Dk of -43 ppm/°K
• Coefficient of thermal expansion matched to copper
• Available in a thickness range of .0015 to .500 inches +/- .0015”

Benefits

• Mechanical properties resist creep and cold flow
• Resistant to process chemicals, reducing damage during fabrication
• Material does not require a sodium napthanate treatment prior to electroless plating
• Based on a thermoset resin, allowing for reliable wire-bonding

Applications

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