TC600™ Laminates

TC600 laminates best-in-class thermal conductivity and mechanical robustness enable printed circuit board (PCB) size reduction. The increased thermal conductivity provides higher power handling, reduces hot-spots and improves device reliability.

Features

• Dielectric constant (Dk) of 6.15
• High thermal conductivity of 1.0W/mK
• Stable Dk across wide temperature range of -75ppm/°C from -40°C to 140°C
• Low loss tangent of .002 at 10 GHz
• Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C)

Benefits

• Enables size reduction of PCB relative to lower Dk substrates
• Reduced heat generated through transmission line loss
• Improved processing and reliability
• CTE matches active components for low stress solder joints

Applications

View current applications of this product.

Backhaul Radios

Communications
Systems

Thermal Solutions

• Backhaul Radios
• Communications
  Systems
• Thermal Solutions