TC350™ Plus Laminates

TC350 Plus materials offer the designer a unique combination of lower loss tangent (and insertion loss) and high thermally conductive fillers to enable superior reliability and reduced operating temperatures in high power applications.

Features

• Dielectric constant (Dk) of 3.5
• High thermal conductivity of 1.24 W/m-K
• Low thermal coefficient of Dk at -42 ppm/°C, -40°C to 140°C
• Low loss tangent of .0017 at 10 GHz
• Low Z-axis coefficient of thermal expansion (CTE) at 38 ppm/°C

Benefits

• Reduced junction temperature and improved reliability
• Reduced heat generated through transmission line loss
• Improved bandwidth utilization and efficiency for amplifiers and antennas
• High plated through hole reliability
• CTE matches active components for low stress solder joints