RT/duroid® 6035HTC Laminates

RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.

Features

• Dielectric constant of 3.50 +/- .05
• Dissipation factor of .0013 at 10GHz
• Thermal conductivity of 1.44 W/m/K at 80°C
• Thermally stable low profile and reverse treat copper foil

Benefits

• High thermal conductivity
• Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
• Excellent high frequency performance
• Lower insertion loss and excellent thermal stability of traces

Applications

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