RO4360G2™ Laminates

RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO4400™ series prepreg and lower-Dk RO4000® laminate in multi-layer designs.

Features

• Dk of 6.15 +/- 0.15
• Low dissipation factor of 0.0038 at 10 GHz
• High thermal conductivity of 0.75 W/(m-K)
• Low Z-axis coefficient of thermal expansion at 28 ppm/°C
• High Tg greater than 280 °C TMA

Benefits

• Automated assembly compatible
• Plated through-hole reliability
• Environmentally friendly – lead free process compatible
• Efficient supply chain and short lead times makes for cost effective material option

Applications

View current applications of this product.

Backhaul Radios

Communications
Systems

Power Amplifiers

Small Cells / DAS

• Backhaul Radios
• Communications
  Systems
• Power Amplifiers
• Small Cells / DAS