CuClad® 233 Laminates

CuClad 233 laminates use a medium fiberglass/PTFE ratio to balance the lower dielectric constant (Dk) and improved dissipation factor without sacrificing mechanical properties. The CuClad 233 laminates have a cross plied construction that provides greater dimensional stability with balanced electrical and mechanical properties.

Features

• Dk of 2.33
• Dissipation factor of .0013 at 10 GHz
• Low moisture absorption and out-gassing
• Stable Dk over a wide frequency range

Benefits

• Low Dk supports wider line widths for lower insertion loss
• Low circuit losses at high frequency
• Supports large PCB and Antenna format
• CuClad 233 CTE value in-plane matches aluminum used for aircraft skins/structures

Applications

View current applications of this product.

Antenna Systems

Communications
Systems

Handheld Device Cellular and Wifi Antenna

• Antenna Systems
• Communications
  Systems
• Handheld Device Cellular and Wifi Antenna