CuClad® 217 Laminates

CuClad 217 laminate’s cross plied construction provides in-plane electrical and mechanical isotropy. CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant (Dk) and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.

Features

• Dk of 2.17 or 2.20
• Dissipation factor of .0009 at 10 GHz
• Low moisture absorption and out-gassing
• Stable Dk over a wide frequency range

Benefits

• Low Dk supports wider line widths for lower insertion loss
• Low circuit losses at high frequency
• Design flexibility in PCB fabrication benefits from improved dimensional stability
• Enables designers to meet strict specifications

Applications

View current applications of this product.

Antenna Systems

Communications
Systems

Handheld Device Cellular and Wifi Antenna

• Antenna Systems
• Communications
  Systems
• Handheld Device Cellular and Wifi Antenna