CLTE™ Laminates

CLTE laminates have proven excellent dimensional stability and low planar CTE, providing consistent performance for embedded resistors: among the lowest variance available for PTFE-based laminates. CLTE laminates have a long history of use with Resistor Foil and are available with a full range of other cladding types (including electrodeposited, reverse treated copper, rolled copper foil or more). CLTE laminates’ tried and tested performance continues to make them a top choice for a wide range of ground-based and airborne communications and radar systems.

Features

• Low thermal expansion in X, Y and Z of 10, 12 and 34 ppm/°C
• Dielectric constant stability with temperature change
• Available as a reliable and consistent thin laminate (.0003”)
• Available with heavy metal backing (aluminum, brass and copper)

Benefits

• High plated through hole reliability
• Reduced stress attachment to ceramic active devices
• Supports complex multi-layer boards
• Reliably designed with embedded resistor networks

Applications

View current applications of this product.

Antenna Systems

Communications
Systems

• Antenna Systems
• Communications
  Systems